Meeting Request for Embedded World 2020

MLE Booth 3A-331 at Embedded World FEB 25-27, 2020

At MLE we share the vision of technology leaders such as IBM, Intel and Xilinx: General purpose compute architectures are running out of steam. Domain-specific compute architectures have become a necessity to deliver higher compute performance.

FPGAs (Field-Programmable Gate-Arrays) and ACAPs (Adaptive Compute Acceleration Platforms) have become the key enabling semiconductor technology for realizing Domain-Specific Architectures. At Embedded World 2020, MLE, and Partners of MLE, will feature solutions, IP cores and Services to de-risk the development of FPGA-based systems.

In short: We accelerate your FPGA design!



Visit Missing Link Electronics at Booth 3A-331

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Featured Technology Partners:.

  • Xilinx in Booth 3A-235 for the new Xilinx Adaptive Compute Acceleration Platform (ACAP)
  • Trenz Electronic in Booth 3A-240 for FPGA-based System-on-Modules
  • CAD-UL ElectronicServices in Booth 4-201 for electronic design and manufacturing services
  • EMCOMO Solutions in Booth 2-259 for MicroTCA FPGA cards and systems
  • Soft-in Embedded in Booth 3A-331 for automotive and embedded system design services

Where to find us: