1 | ©2022 Missing Link Electronics - Storage Networking Industry Association. All Rights Reserved.
A Event
Converging PCIe and TSN Ethernet
for Composable Infrastructure in
High-Performance In-Vehicle
Embedded Systems
Endric Schubert, PhD, CTO Missing Link Electronics
Marcus Pietzsch, Research Lead Fraunhofer IPMS
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MLE: “If It Is Packets, We Make It Go Faster!”
MLE is an Integrator and Turnkey Solutions / Systems Provider for
High-Performance (Embedded) Compute & Connected Systems-of-Systems
▪ PCIe (CXL, ISB, NVMe)
▪ Ethernet (TCP/IP, TSN)
▪ Audio/Video (HDMI, SDI)
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MLE Technology & Manufacturing Ecosystem
Fraunhofer Elemaster
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Automotive’s Expensive Wiring Nightmare
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Next: Zone-Based Architectures
More centralized, better to scale, lower cost
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Application Example: “Smart Corner”
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Zone-Based Automotive Networks Need PCIe/NVMe
Driven by Cost/Performance, i.e.
Centralized Compute & Storage:
• PCIe (for Embedded CPUs,
GPUs, FPGAs and SoCs)
• NVMe (for SSDs)
Driven by Compliance
• FuSa ISO 26262
• Security ISO/SAE 21434
• SOTIF ISO 21448
• etc
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“Borrowing” from Datacenter Infrastructure (... and Giving Back)
Aspect Datacenter Infrastructure In-Vehicle Networks
Longevity ~ 15 years ~ 15 years
Proper functioning High-Availability via SLA Functional Safety as in ISO 26262
Security Encryption in flight and at rest
ISO 27001 etc
Soon: Encryption in flight and at rest
ISO 21434
Network timing behavior Low tail-end transport latency
Avoid congestion and HoL blocking
Deterministic low latency
Real-time
Environmental Low power and high energy efficiency Low power and high energy efficiency
Resistant to shock, vibration, temp
cycles
Number of nodes within system 100s of thousands < 10
Flexibility needs ability to deal with many different work loads,
screwdriver-less add/change HW and SW
ability to field-upgrade functionality and
security, screwdriver OK
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Composable Datacenter Infrastructure
Automotive
▪ Today: Traditional
(~100 ECUs)
▪ Next: Leap-frog towards
Composable i/f
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Sensor Open Systems Architecture (SOSA)
Other Embedded
▪ Similar life-cycle challenges
▪ Need for field-upgrade and
in-field repair
▪ Connectivity based on
▪ PCIe/NVMe
▪ Ethernet
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Why PCI Express?
• Future-proof road-map, driven by PCI-SIG
• NVM Express cost/performance/power optimized storage
• PC, Cloud Computing, Embedded Systems drive this roadmap
• Best-in-class price ($) per performance (Gbps) ratio
• Common to modern SoCs, ability to commoditize silicon
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Why Ethernet?
• Future-proof road-map
• PC, Cloud Computing,
Embedded Systems drive this
roadmap
• Best-in-class price ($) per
performance (Gbps) per
length (meters) ratio
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Why TSN?
▪ Time Sensitive Networking
▪ The history
▪ AVB Task Group for latency free delivery of audio/video data
▪ 2012 the TSN Task Group evolved from the AVB Task Group (IEEE 802.1)
▪ TSN is not a single standard
▪ It‘s a collection of sub standards and extensions
▪ Network wide time synchronization
▪ Determinism
▪ Low latency
▪ Low jitter
▪ Scalable speed
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TSN Profiles & Standards
▪ Standards
▪ Time Synchronization (802.1AS & it‘s profile IEEE 1588, 802.1AS/-2020)
▪ Bounded low latency (802.1Qav, 802.1Qbv, 802.3br & 802.1Qbu, 802.1Qch, P802.1Qcr, P802.1Qcr,
P802.1DC)
▪ High availability/reliability (802.1CB, 802.1Qci, 802.1Qca)
▪ Resources and API (802.1Qat, 802.1Qcc, 802.1Qcp, P802.1Qcx, P802.1ABcu, P802.1Qcw,
802.1CBcv, P802.1CS, P802.1Qdd, P802.1CBdb..)
▪ Profiles
▪ Audio Video Bridging (802.1BA)
▪ Fronthaul (802.1CM)
▪ Industrial Automation( IEC/IEEE P60802)
▪ Automotive In-Vehicle (P802.1DG)
▪ Service Provider (P802.1DF)
▪ TSN for Aerospace Onboard Ethernet (P802.1DP)
▪ TSN for Avionics (SAE AS-1A2*)
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TSN Technology from Fraunhofer IPMS
TSN-SW
TSN-SE
TSN-GW
TSN-EP
TSN-SE TSN-EP
Pre-Certified & cut through IP Cores
▪ TSN Endpoint (TSN-EP)
▪ TSN Switched Endpoint (TSN-SE)
▪ TSN Switch (TSN-SW)
▪ CAN, LIN
Solutions
▪ Automotive Network bridges & gateways
▪ LIN, CAN, CAN-FD, CAN-XL,… over TSN
▪ Automotive communication subsystems
▪ EMSA5-FS co integrated TSN solutions
CAN-FD
CAN
LIN
CAN-XL
PCIE, CSI,
I2C, SPI, UART
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Challenges for TSN at Multi-Gigabit Speeds
TSN <= 1 Gbps
▪ Used in industrial networks
▪ Limited amount of data,
mostly for control
▪ SW-rich systems running RTOS
▪ CPUs fast enough for data
processing
▪ DMA i/f to SW
▪ Little or no offloading needed
TSN >= 10 Gbps
▪ High-performance distributed
systems in vehicles and robots
▪ Large amounts of data from
sensors
▪ Radar, Lidar, Cameras
▪ CPUs too slow for data
processing mostly
▪ Onchip stream i/f
▪ Fixed and programmable
function accelerators
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TSN Technology from Fraunhofer IPMS
168 ns 288 ns
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Why TCP?
Benefits
▪ PCIe Transport Layer required
reliability
▪ Long established and well
understood SW API
▪ On-chip Full Accelerator from
Fraunhofer HHI
▪ Industry-proven
▪ Resource efficient
▪ 128 bit wide for up to 100 Gbps
linerate processing
▪ Low and deterministic latency
(700 ns RTT for 100B)
PCIe Offset
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Converging PCIe/NVMe and TSN - Automotive Connectivity
PCIe-over-TSN
NVMe-over-TSN
over 10/25/50/100 GigE
over copper/fiber
CPU to CPU
via PCIe NTB
CPU to CPU
via PCIe NTB
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PCIe-over-TSN / NVMe-over-TSN Hardware Portion
▪ PCIe from PCI-SIG, TSN from IEEE
▪ Symmetric for CPU-to-CPU (e.g. PCIe NTB) or Asymmetric Sensor-to-CPU
▪ US Patents 10,140,049 10,708,199 10,848,442 11,356,388
PCIe-over-TSN over
10/25/50/100 GigE
over copper/fiber
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Our Contact Information
Missing Link Electronics GmbH
+49 (731) 141149-0
Industriestrasse 10
89231 Neu-Ulm
Germany
Email contact: sales-web@mlecorp.com
Missing Link Electronics, Inc.
+1 (408) 475-1490
2880 Zanker Road, Suite 203
San Jose, CA 95134
United States
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PCIe-over-TSN / NVMe-over-TSN System Stack
System Stack is
• Hardware (Digital Circuit)
• Software (Drivers)
Features
• PCIe Endpoint and Root-Port in FPGA/ASIC
• PCIe Switch in FPGA/ASIC
• PCIe NTB in FPGA/ASIC
• TCP/UDP/IP over TSN in FPGA/ASIC
• netdev Linux Device Drivers
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PCIe-over-TSN Concept: A Distributed PCIe Switch
TSN
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PCIe-over-TSN Concept: Distributed PCIe Switch
Encapsulate and Decapsulate PCIe TLPs. PCIe demands reliability, therefore we transport
TLPs over TCP/IP over TSN over Ethernet.
TSN
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PCIe-over-TSN / NVMe-over-TSN Lab Car
Labcar Setup w/ PCIe Connect to HPC Labcar Setup for Experiments
PCIe/NVMe PCIE NTB
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NVMe-over-TSN Results With SSD
Linux lspci
00:00.0 Host bridge [0600]: Advanced Micro Devices, Inc. [AMD] Device [1022:15d0]
00:01.0 Host bridge [0600]: Advanced Micro Devices, Inc. [AMD] Device [1022:1452]
01:00.0 PCI bridge [0604]: Xilinx Corporation Device [10ee:9034] (prog-if 00 [Normal decode])
Control: I/O+ Mem+ BusMaster+ SpecCycle- MemWINV- VGASnoop- ParErr- Stepping- SERR- FastB2B- DisINTx-
Status: Cap+ 66MHz- UDF- FastB2B- ParErr- DEVSEL=fast >TAbort- <TAbort- <MAbort- >SERR- <PERR- INTx-
Latency: 0, Cache Line Size: 64 bytes
Bus: primary=01, secondary=02, subordinate=03, sec-latency=0
Capabilities: [70] Express (v2) Upstream Port, MSI 00
Capabilities: [1c0 v1] #19
Kernel driver in use: pcieport
Kernel modules: shpchp
02:00.0 PCI bridge [0604]: Xilinx Corporation Device [10ee:9134] (prog-if 00 [Normal decode])
Control: I/O+ Mem+ BusMaster+ SpecCycle- MemWINV- VGASnoop- ParErr- Stepping- SERR- FastB2B- DisINTx-
Status: Cap+ 66MHz- UDF- FastB2B- ParErr- DEVSEL=fast >TAbort- <TAbort- <MAbort- >SERR- <PERR- INTx-
Latency: 0, Cache Line Size: 64 bytes
Bus: primary=02, secondary=03, subordinate=03, sec-latency=0
Capabilities: [70] Express (v2) Downstream Port (Slot+), MSI 00
Capabilities: [1c0 v1] #19
Kernel driver in use: pcieport
Kernel modules: shpchp
03:00.0 Non-Volatile memory controller [0108]: Samsung Electronics Co Ltd Device [144d:a808] (prog-if 02 [NVM Express])
Subsystem: Samsung Electronics Co Ltd Device [144d:a801]
Control: I/O- Mem+ BusMaster+ SpecCycle- MemWINV- VGASnoop- ParErr- Stepping- SERR- FastB2B- DisINTx+
Status: Cap+ 66MHz- UDF- FastB2B- ParErr- DEVSEL=fast >TAbort- <TAbort- <MAbort- >SERR- <PERR- INTx-
Latency: 0, Cache Line Size: 64 bytes
Interrupt: pin A routed to IRQ 30
NUMA node: 0
Region 0: Memory at fcf00000 (64-bit, non-prefetchable) [size=16K]
Kernel driver in use: nvme
Kernel modules: nvme
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PCIe Non-Transparent Bridge
o Non-Transparent Bridge (NTB) connects multiple Root Ports
o Example of NTB Back-2-Back
(Example from Intel Xeon C5500)
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Delivering Performance for PCIe NTB
Write-Only Communication via Doorbells - NVMe-style
o Avoids difficulties
of multi-device
o Scales to >32 RCs
o Posted Writes
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PCIe-over-TSN for NTB Lab Car
Labcar Setup w/ PCIe Connect to HPC Labcar Setup for Experiments
PCIe/NVMe PCIE NTB
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PCIe-over-TSN for Non-Transparent Bridging (NTB)
> lspci -vt
-[0000:00]-+-00.0AdvancedMicroDevices,Inc.[AMD]Raven/Raven2RootComplex
+-00.2AdvancedMicroDevices,Inc.[AMD]Raven/Raven2IOMMU
+-01.0AdvancedMicroDevices,Inc.[AMD]Family17h(Models00h-1fh)PCIeDummy
Host Bridge
+-01.1-[01]----00.0MissingLinkElectronicsDevice22fb
...
> lspci -vv -s 01:00.0
01:00.0 Memory controller: Missing Link Electronics Device 22fb
Subsystem:XilinxCorporationDevice0007
Control:I/O-Mem+BusMaster+SpecCycle-MemWINV-VGASnoop-ParErr-Stepping-SERR-
FastB2B- DisINTx+
Status:Cap+66MHz-UDF-FastB2B-ParErr-DEVSEL=fast>TAbort-<TAbort-<MAbort->SERR-
<PERR- INTx-
Latency:0,CacheLineSize:64bytes
Region0:Memoryatd0000000(64-bit,prefetchable)[size=256M]
Region2:Memoryatc0000000(64-bit,prefetchable)[size=256M]
Region4:Memoryatfcf10000(32-bit,non-prefetchable)[size=64K]
Region5:Memoryatfcf00000(32-bit,non-prefetchable)[size=64K]
Capabilities:[1c0v1]#19
Kerneldriverinuse:ntb_hw_mle
Kernelmodules:ntb_hw_mle
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Convergence of PCIe/NVMe and TSN - Conclusion
Foundation Technology With Many Applications
Built on top of open
standards from PCI-
SIG and IEEE
Implemented in
ASIC and FPGA
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Today TCP:
▪ PCIe-over-TSN / NVMe-over-
TSN
Next Homa:
▪ Alternatives to TCP
for Storage
▪ Add security
Outlook & Future Work
NVMe-over-Homa?
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Today: PCIe-over-TSN /
NVMe-over-TSN
Next Steps: MLE Investigating
Alternatives to TCP for
Storage:
NVMe-over-Homa
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TSN Standards (1)
▪ Network wide operation
▪ Non 802.1as capable devices break up network
▪ Periodic announce messages
▪ Grand Master (GM) is selected for device with the
best master clock algorithm (BMCA)
▪ Periodical Sync + Followup frames
▪ delay measurement is a two-step peer-to-peer
path delay algorithm
Time synchronization - IEEE 802.1AS (AS-2020)
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TSN Standards (2)
▪ Forwarding and Queuing
Enhancements for Time-Sensitive
Streams
▪ Allready used in AVB
▪ Credit based scheduling
▪ Positive credit allowing traffic to be sent
▪ Negative credit will prevent packets to
be send
IEEE 802.1Qav - Credit Based Shaper
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TSN Standards (3)
▪ Cycle based scheduling of frames
▪ Cycle length
▪ A number of gate operations
▪ Guard bands prevent violation of cycle timings
IEEE 802.1Qbv - Time Aware Shaper
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TSN Standards (4)
▪ Extreme low latency for chosen traffic (express traffic)
▪ Special mPackets (express packet, preemptable packet, fragment of a packet)
▪ 64bytes of minimal fragment size
802.3br & 802.1Qbu – Frame preemption
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TSN Standards (5)
▪ Sequence generation
▪ Split/Recovery
▪ Redundancy tag seq encode/decode
▪ Stream identification
▪ Link aggregation (802.1AX)
IEEE 802.1CB - Frame replication and elimination for redundancy
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TSN Standards (6)
▪ Filtering and policing and frame queue
decisions made on a per-stream basis for
received frames
▪ Stream gate id ᾆ open/closed
IEEE 802.1Qci – Per-Stream Filtering and Policing (PSFP)