MLE presents “PCI Express over IP, Accelerated – A Low Latency Fabric for System-of-Systems” – presenting a hardware processing solution that transparently tunnels PCI Express transaction-layer packets over TCP/IP.
(download slides) or visit our technical publications.
MLE presents "Designing FPGA-Accelerators for Linux Software Using High-Level Synthesis" – to share hands-on insight and user experience on Xilinx' new SDSoC toolchain.
(download slides) or visit our technical publications.
MLE partners with EMCOMO Solutions AG at Booth 2-421 in Hall 2 to offer free advice from our FPGA engineers. In addition, MLE hosts a demo at the Xilinx booth 1-205 in Hall 1 to showcase image processing capability of FPGAs. Stop by or visit one of our presentations at the Embedded World Conference.
Missing Link Electronics presents a way to minimize userspace latencies via hardware-acceleration of networking protocol stacks.
(download slides) or visit our technical publications.
In the area of Mixed Signal Systems, Missing Link Electronics has been awarded US Patent 09,209,828 for “Configurable Mixed Signal Systems”.
Missing Link Electronics presents examples for the prolonged lifespan of FPGA SoCs and embedded systems in a fast-paced CPU market.
(download slides) or visit our technical publications.
Missing Link Electronics Germany announces doubling of the research and development space in Neu-Ulm. “The newly acquired premises will help us acommodate more staff and equipment to achieve further progress”, says Sebastian Stiemke, Director of Engineering.
Missing Link Electronics presents an approach to test the hardware of FPGAs and ASICs during the development stage. MLE would like to thank the Ingenieurbüro Paul Huber for hosting the Test Engineering Day this year. (download slides) or visit our technical publications.
Fraunhofer HHI and MLE will be available at the Embedded World Exhibition 2015 to discuss benefits of and applications for TCP/UDP/IP Accelerator Technology for FPGAs and ASICs. Please visit us at Booth 4-550 in Hall 4 at the Embedded World Exhibition&Conference 2015.