News
MLE continues to work with a wide range of partners to develop advanced FPGA-based networking and storage applications, as well as to share our experience and latest research results in seminars as well as webinars. Here we share our latest news and events.
SNIA Storage Developers Conference, Sept. 18-21, 2023 in Fremont, CA
The Storage Developers Conference (SDC) 2023 of SNIA, the Storage and Networking Industry Alliance, will be held Sept. 18-21 in Fremont, CA. There, MLE will present “How Bad is TCP?…
MLE Joins the EtherCAT Technology Group
EtherCAT, the Ethernet Fieldbus, is the open real-time Ethernet network originally developed by Beckhoff. EtherCAT sets new standards for real-time performance and topology flexibility. Nick-named “Robo/TSN”, MLE is extending its…
Corundum DPDK Driver
MLE presents an initial DPDK driver for the corundum multi-queue network interface card (mqnic). The driver is available via the respective github repository of Missing Link Electronics. DPDK is the…
Berlin 6G Conference
Berlin 6G Conference is the annual networking event of the German 6G Program, organized by the 6G Platform Germany, will take place at the Berlin Congress Center (BCC) from June…
Trenz Electronic GmbH and Missing Link Electronics, Inc. Enter Strategic Partnership to Deliver Turnkey Solutions and Full System Stacks with FPGA
Trenz Electronic GmbH (Trenz), Hüllhorst, Germany, and Missing Link Electronics, Inc. (MLE), San Jose, CA, both Premier Members of the AMD Adaptive Computing Partner Program, have entered a strategic partnership…
US Patent 11,695,708 for Deterministic Real-Time Multi-Protocol Heterogeneous Packet-Based Transport
The United States Patent and Trademark Office (USPTO) has allowed Missing Link Electronics the US Patent 11,695,708 for Deterministic Real-Time Multi-Protocol Heterogeneous Packet-Based Transport a technology that finds a wide…
MLE Demoes at AMD’s Authorized Training Provider and Premier Partner Summit
June 13-15 2023, MLE attends AMD’s Authorized Training Provider and Premier Partner (ATP) Summit and, together with fellow partner Trenz Electronic GmbH, will demo a 40 GigE SD-WAN Customer Premise…
MLE Updates TCP/UDP/IP Network Protocol Accelerator Platform
MLE has updated NPAP, the Network Protocol Accelerator Platform based on Fraunhofer HHI’s TCP/UDP/IP stack for ASIC and FPGA. Work includes enhancements for performance and interoperability when connecting to Microsoft…
MLE Presents at Embedded World 2023
5G Radio addresses machine-type communication with low energy demands. 5G Edge Clouds reduce processing latency by bringing extra compute close to the “edge”. To be cost efficient, Edge Cloud systems…
MLE Opens R&D Offices at Schindler Innovation Hub in Berlin
Berlin has always been a hot-bed for research and development of new communication technologies. BMBF funded Project 6G-ICAS4Mobility along with the German Platform for Future Communication Technologies and 6G (6G…