# trenz
Multi-Gigabit Network Virtualization at Embedded World 2025
Visit MLE at Embedded World 2025! The Embedded World 2025 Exhibition and Conference will take place from March 11-13 in Nuremberg, Germany. This year, partner MLE technology will be featured…
MLE Joins the Standardization Group for Embedded Technologies (SGeT) for Harmonized FPGA Module Standard Development
Standardization Group for Embedded Technologies (SGeT) is dedicated to developing, promoting, and marketing open standards for embedded hardware and software, and, recently, has embraced working on the needs for FPGA…
Shift-Left Your FPGA Design Project with FPGA Full System Stacks from Trenz Electronic and MLE
Visit us at Embedded World 2024! The Embedded World 2024 tradeshow will be held April 9-11 in Nuremberg, Germany. Here, partners Trenz Electronic and MLE will present solutions for you…
MLE and Trenz Verify the AMD/Xilinx Versal™ AI Edge Device and Accelerate Networking and Storage with 10G/25G/50G/100G TCP/IP Core
MLE and Trenz Electronic, both Premier Members of the AMD Adaptive Computing Partner Program, have collaborated and worked on Trenz’s new TE0950 AMD/Xilinx Versal™ AI Edge Evalboard to provide an…
Trenz Electronic GmbH and Missing Link Electronics, Inc. Enter Strategic Partnership to Deliver Turnkey Solutions and Full System Stacks with FPGA
Trenz Electronic GmbH (Trenz), Hüllhorst, Germany, and Missing Link Electronics, Inc. (MLE), San Jose, CA, both Premier Members of the AMD Adaptive Computing Partner Program, have entered a strategic partnership…
MLE Demoes at AMD’s Authorized Training Provider and Premier Partner Summit
June 13-15 2023, MLE attends AMD’s Authorized Training Provider and Premier Partner (ATP) Summit and, together with fellow partner Trenz Electronic GmbH, will demo a 40 GigE SD-WAN Customer Premise…
MLE and Trenz Electronic Deliver FPGA Turnkey Solutions
Missing Link Electronics (MLE) has partnered with Trenz Electronic to deliver FPGA-based turnkey solutions integrating FPGA and SoC modules manufactured by Trenz and IP Cores and Subsystems from MLE.