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      Multi-Gigabit Network Virtualization at Embedded World 2025

      MLE and Trenz at Embedded World 2025 - EW25 banner

      The Embedded World 2025 Exhibition and Conference will take place from March 11-13 in Nuremberg, Germany.

      This year, partner MLE technology will be featured by the following partners:


      📍Hall 5, booth #5-140

      Auto/TSN enables Software-Defined Vehicles (SDV) and zonal architectures by virtualizing industry-standard automotive such as CAN, LIN, or CSI-2 for transport over in-vehicle network “backbones”.

      Auto/RPS is MLE’s FPGA-based Rapid Prototyping System (RPS) catering to the specific needs of automotive engineers designing next-generation Zone Based Architectures. MLE Auto/RPS enables automotive system engineers to design and to validate software-defined vehicle (SDV) functions along with MLE Auto/TSN in-vehicle networking.


      📍Hall 5, booth #5-140

      Robo/TSN virtualizes IT for OT fieldbuses such as ProfiNET and EtherCAT to connect the factory cloud to the factory floor.


      📍Hall 5, booth #5-135

      📍Hall 3A, booth #3A-125

      100_200_400G Fast FPGA RAID (FFRAID) Data Recorder Application Scenario

      MLE Fast FPGA RAID (FFRAID) is a fast and FPGA-based NVMe RAID solution that can transfer bulky data from multiple sensors to a RAID of NVMe SSDs at speeds up to 400 Gbps. The FFRAID implements a channel-based architecture, supports data-in-motion pre- and post-processing and is highly scalable with regards to bandwidth and recording capacity. 

      MLE FFRAID runs on AMD Alveo U55C High Performance Compute Card and AMD Alveo V80 Compute Accelerator.


      Altera Agilex 5E SmartNIC

      Altera solution acceleration partner

      📍Hall 5, booth #5-343

      📍Hall 4A, booth #4A-342

      Arrow AXE5 Eagle Board_top

      Altera, Arrow and MLE have worked together to migrate MQNIC, an FPGA-based Network Interface Card (NIC) from the open source Corundum.io project to Altera Agilex 5E on the Arrow AXE5 Eagle Development Platform.


      High Performance Analog Meets AI

      📍Hall 1, booth #1-301

      ADI Data Extraction Infrastructure

      Analog Devices and MLE will be sharing solutions that are redefining high-speed Ethernet connectivity. Together, they are paving the way for the next generation of embedded applications across various markets ranging from automotive to industrial automation to IoT.


      Lattice Avant-G/X Industrial SmartNIC

      📍Hall 4, booth #4-528

      Lattice Avant-G-Versa-Top-View

      Lattice and MLE have worked together to migrate MQNIC, an FPGA-based Network Interface Card (NIC) from the open source Corundum.io project to Lattice Avant-G and Avant-X FPGAs on the Lattice Avant-G/X Versa Board.


      Accelerated TCP/IP for High-Speed Camera Connectivity

      📍Hall 3A, booth #3A-135

      NPAP, the TCP/IP Full Accelerator from Fraunhofer HHI, provides TCP connectivity in accordance with the GigE Vision standard. Microchip has worked with MLE to integrate and to optimize MLE NPAP for PolarFire and PolarFire SoC, suitable for next-generation camera products.


      Date: March 11-13, 2025

      Location: Nuremberg Convention Center, Nuremberg, Germany

      Booth: Hall 5 #5-140

      Visit us at booth #5-140 and talk with our FPGA experts to learn about how to accelerate your industrial network connectivity with a “shift-left approach”!

      MLE Partners at Embedded World 2025

      Altera solution acceleration partner