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      Intel Partner Alliance Gold Status Renewed

      Intel Corporation has renewed MLE’s Gold Status membership in the Intel Partner Alliance for 2023. The Intel Partner Alliance unifies all partners in a modern program that enables collaboration and innovation. MLE ships Function Accelerator Cards based on Intel Stratix Series FPGAs and has been providing FPGA Design Services for a wide range of Intel FPGAs including Intel Agilex FPGAs and SoC FPGAs, Intel Stratix Series, Intel Arria Series, Intel MAX Series, Intel Cyclone Series and Intel eASIC. As a Gold Member of the Intel Partner Alliance MLE has access to FPGA Design Tools such as the Intel Quartus Prime Design Software, the Questa-Intel FPGA Edition Software plus the Open-Source Intel Compiler for SystemC.

      MLE’s Auto/TSN for Digital RADAR Networks Receives BMBF Funding

      In-Vehicle Networks of the future will be driven by the large bandwidth needs of modern sensors, in particular Radar (Radio Detection and Ranging), and more importantly networks of digital Radar sensors.

      MLE has joined research initiative “VERANO” to advance MLE’s Auto/TSN and to support research partners Infineon Technologies AG, Mercedes-Benz AG, Robert BOSCH GmbH, KPIT Technologies GmbH, Fraunhofer IPMS, KIT, Ulm University, Ruhr-University Bochum, Technical University Braunschweig and Kassel University with deep FPGA expertise.

      The “VERANO” project will investigate digital and energy-efficient Radar networks for automotive and autonomous vehicles and is funded with 11.1 Mio Euros by the Research Initiative OCTOPUS from German Federal Ministry of Education and Research (BMBF).

      Future-proof PCI Express Card With Microchip PolarFire FPGA

      To future-proof an FPGA-based PCI controller card, Mattson Thermal Products GmbH in Ulm, Germany, worked with Elemaster and Missing Link Electronics (MLE) to re-design the card for PCI Express (PCIe).

      Using MLE’s PCIe Connectivity subsystem for Microchip PolarFire FPGA, the former PCI card implemented in Xilinx Spartan 2 FPGA could be replaced without changes to the operating system PCI/PCIe device drivers.

      Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits.

      Microchip PolarFire FPGA deliver the industry’s lowest power at mid-range densities with exceptional security and reliability and are ideal for a wide range of applications such as industrial automation. MLE is a Premier Design Partner of the Microchip Ecosystem.

      MLE exhibits at SC22

      Partner ProDesign and MLE will showcase High-Performance Compute solutions at Super Computing Conference SC22. To address the acceleration needs of Disaggregated Computational Storage, ElasticSearch, or At-Speed In-Network Processing the featured solutions integrate MLE’s FPGA-based networking and storage accelerators with ProDesign’s FALCON 1SM21 HPC Card (based on Intel Stratix 10 MX/NX FPGA) and ProDesign’s HAWK VC1902 HPC Card (based on AMD/Xilinx Versal FPGA). Also featured will be Homa, a reliable, rapid request-response protocol (RRRRP) from Stanford University professor John Ousterhout. SC22 is held November 13-18 in the Kay Bailey Hutchinson Convention Center Dallas, TX.

      MLE Joins German 6G Radio Initiative, Receives BMBF Funding

      Integrated Communication and Sensing (ICAS) has become a key research topic for realizing next-generation mobility solutions. For 6G Radio, ICAS enables sensor systems to cooperate and to interact via 6G Radio Sidelink.

      MLE has joined research project “6G-ICAS4Mobility” to closely collaborate with other research partners Robert BOSCH GmbH, AeroDCS GmbH, Barkhausen Institut gGmbH, CiS GmbH, Denso Automotive Deutschland GmbH, Friedrich-Alexander-University Erlangen-Nuremberg, Fraunhofer HHI, Hensoldt Sensors GmbH, IMST GmbH, Merantix Labs GmbH, NXP Semiconductors Germany GmbH, Technical University Ilmenau, Technical University Kaiserslautern and Ulm University for realizing such systems.

      “6G-ICAS4Mobility” has been funded with 14.23 Mio Euros by the German Federal Ministry of Education and Research (BMBF) .

      MLE Presents at SNIA SDC 2022

      At SNIA Storage Developers Conference (SDC) 2022, on Sept. 14, MLE and partner Fraunhofer IPMS will present “Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems”: While the needs for storage in automotive are somewhat relaxed, compared to datacenters, automotive has a need for “unconventional” storage connectivity like many sensors to few CPUs to single SSD. And, unlike datacenters, automotive comes with strong constraints for size, weight and power, and real-time guaranties. Time-Sensitive Networking (TSN) is one of the best positioned options for in-vehicle networking. In combination with reliable transports such as TCP/IP this enables deterministic networking for distributed systems. MLE presents the needs of modern automotive networking and storage architectures, and approaches for converging (real-time) Ethernet and PCIe as a common fabric for reliable and cost-efficient implementations.

      US Patent 11,356,388 for Real-Time Multi-Protocol Heterogeneous Packet-Based Transport

      Missing Link Electronics has been awarded US Patent 11,356,388 on Real-Time Multi-Protocol Heterogeneous Packet-Based Transport which covers real-time and time-synchronization aspects when tunneling packets such as PCI Express (PCIe) Transaction-Layer Packets (TLP) over reliable TCP/IP over 1/10/25/50/100G Ethernet. This extends the range of PCIe and enables building distributed systems based on PCIe, or other packed-based protocols.

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      Network Element Virtualization (NEV) With FPGA

      To enable Network Element Virtualization (NEV) for telefommunications Algoblu Co. L.t.d. from Ottawa, Ontario, Canada, has worked with Missing Link Electronics (MLE) to design and test FPGA-based turnkey solutions.

      With NEV technology, carriers can virtualize the underlying network and can fine-tune the management of network resources to provide multi-tiered services with end-to-end service quality assurance. At Provider Equipment (PE) level, NEV has been implemented as an FPGA-based PCIe card to accelerate Algoblu software running on server CPUs. For the corresponding Customer Premise Equipment (CE) a turnkey solution was designed based on an off-the-shelf FPGA System-on-Module. For more information on the NEV technology, please read the Network Element Virtualization (NEV) Whitepaper here.

      Network Element Virtualization Whitepaper

      SmartNICs Make Better Networks! At SmartNICsSummit 2022, held April 26-28 in the Doubletree Hotel in San Jose, CA, Algoblu and MLE will present solutions for NEV and the use case of low-latency application. For more details, please read the joint whitepaper “Network Element Virtualization”. With a foreword by Awanish Verma, Principal Architect and Director in the newly formed Data Center and Communications Group (DCCG) at AMD, Algoblu, a NaaS provider, and Missing Link Electronics, a premier partner in Xilinx Alliance ecosystem, will show how they use FPGA technology to implement Network Element Virtualization (NEV) to accelerate SD-WAN adoption.