MLE’s partner, Trenz Electronic, offers FPGA Starterkits, FPGA modules (System-on-Modules), Carrier Boards and Chip-Down Turnkey Solutions.
FPGA Starter Kits
FPGA Starterkits get you faster and closer towards your FPGA target hardware. Trenz Electronic has been designing Starterkits for engineering purposes: Components have been carefully selected for availability, cost / performance and manufacturability (not just for marketing reasons). And, more important, Trenz Electronic Starterkits have a clear path towards product ramp-up, either via a risk-optimized, customized baseboard with a SoM, or via a cost-optimized so-called chipdown implementation.
FPGA Modules (System-on-Modules)
FPGA Modules, (System-on-Modules, SoM) are Components Off-the-Shelf (COTS) which significantly de-risk your system design because many tedious and risky engineering steps have been taken care of already: Clock, power, reset, configuration, high-speed memory interfaces, etc have been implemented in a reliable and fully tested module. You can pick from large variety of SoMs with different device families, device temperatures and device speed-grades. This is combined with a very competitive pricing because you benefit from volume-based step-pricing even if you need very few units.
Carrier Board Design for FPGA Modules
Obviously, MLE and Trenz can help you with the design and manufacturing of your custom carrier board. Please contact us to discuss technical and commercial details. Until your custom carrier board arrives we suggest you can start development by using one of our ready-to-run carrier boards:
Chip-Down Turnkey Solutions
Depending on your SWAP-C (Size, Weight and Power and Cost-Down) requirements, your FPGA target hardware can be implemented via a so-called “Chip-Down” Turnkey solution. For a low NRE fee we “stretch” the PCB of the SoM to make additional space for extra components and connectors. Hence, the SoM becomes your FPGA single-board computer. This optimizes the Bill-of-Materials as it removes unwanted components including the headers between the former SoM and the former carrier board.