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      MLE Opens R&D Offices at Schindler Innovation Hub in Berlin

      Berlin has always been a hot-bed for research and development of new communication technologies. BMBF funded Project 6G-ICAS4Mobility along with the German Platform for Future Communication Technologies and 6G (6G Platform) is one of those many examples. To deepen collaboration between MLE and partners at Technical University Berlin, Berliner Hochschule für Technik, Fraunhofer HHI and Fraunhofer Focus, MLE has opened R&D offices at the Schindler Innovation Campus in Berlin.

      MLE Participates at AMD/Xilinx Security Working Group 2022

      The AMD-Xilinx Security Working Group takes place face-to-face in Munich, Germany, from December 6-7, 2022. Presentations include the latest security features in Versal ACAP and updates for the product roadmap.

      MLE, a Premier AMD-Xilinx Alliance Member, will participate and present its security solutions for ARM OP-TEE and for hardening AMD-Xilinx Zynq UltraScale+ MPSoC based systems when used in datacenter networking and telecommunications.

      MLE Joins Central Car Server Supercomputing Research for Automotive, Funded by German BMBF

      Advanced Driver-Assist Systems (ADAS) and Autonomous Vehicle (AV) functions require a challeging combination of of compute performance and energy efficiency, especially when deployed in Battery Electric Vehicles (BEV).

      MLE has joined research initiative “Central Car Server (CeCaS)” to advance MLE’s PCIe connectivity solutions based on PCIe NTB (Non-Transparent Bridging), PCIe ISB (Inter Systems Bridge), PCIe Long-Range Tunnel along with partners Infineon Technologies Dresden GmbH & Co. KG, Dresden, Robert Bosch GmbH, Continental Automotive Technologies GmbH, ZF Friedrichshafen AG, AVL Software and Functions GmbH, Hella GmbH & Co. KGaA, Infineon Technologies Semiconductor GmbH, Swissbit Germany AG, Kernkonzept GmbH, Ambrosys GmbH, STTech GmbH, Berliner Nanotest und Design GmbH, Glück Engineering GmbH, INCHRON AG, emmtrix Technologies GmbH, Karlsruher Institut für Technologie (KIT), FZI Forschungszentrum Informatik in Karlsruhe, Lübeck University, TU München, Hochschule für angewandte Wissenschaften München, TU Chemnitz, Steinbeis-Transferzentrum Wärmemanagement in der Elektronik (ZFW), Fraunhofer ENAS, Fraunhofer IPMS, Fraunhofer IMWS, Fraunhofer IZM.

      The “CeCaS” research project will investigate heterogeneous architectures and supercomputing for automotive and autonomous vehicles and is funded with 88.2 Mio Euros by the Research Initiative MANNHEIM from German Federal Ministry of Education and Research (BMBF).

      Intel Partner Alliance Gold Status Renewed

      Intel Corporation has renewed MLE’s Gold Status membership in the Intel Partner Alliance for 2023. The Intel Partner Alliance unifies all partners in a modern program that enables collaboration and innovation. MLE ships Function Accelerator Cards based on Intel Stratix Series FPGAs and has been providing FPGA Design Services for a wide range of Intel FPGAs including Intel Agilex FPGAs and SoC FPGAs, Intel Stratix Series, Intel Arria Series, Intel MAX Series, Intel Cyclone Series and Intel eASIC. As a Gold Member of the Intel Partner Alliance MLE has access to FPGA Design Tools such as the Intel Quartus Prime Design Software, the Questa-Intel FPGA Edition Software plus the Open-Source Intel Compiler for SystemC.

      MLE’s Auto/TSN for Digital RADAR Networks Receives BMBF Funding

      In-Vehicle Networks of the future will be driven by the large bandwidth needs of modern sensors, in particular Radar (Radio Detection and Ranging), and more importantly networks of digital Radar sensors.

      MLE has joined research initiative “VERANO” to advance MLE’s Auto/TSN and to support research partners Infineon Technologies AG, Mercedes-Benz AG, Robert BOSCH GmbH, KPIT Technologies GmbH, Fraunhofer IPMS, KIT, Ulm University, Ruhr-University Bochum, Technical University Braunschweig and Kassel University with deep FPGA expertise.

      The “VERANO” project will investigate digital and energy-efficient Radar networks for automotive and autonomous vehicles and is funded with 11.1 Mio Euros by the Research Initiative OCTOPUS from German Federal Ministry of Education and Research (BMBF).

      Future-proof PCI Express Card With Microchip PolarFire FPGA

      To future-proof an FPGA-based PCI controller card, Mattson Thermal Products GmbH in Ulm, Germany, worked with Elemaster and Missing Link Electronics (MLE) to re-design the card for PCI Express (PCIe).

      Using MLE’s PCIe Connectivity subsystem for Microchip PolarFire FPGA, the former PCI card implemented in Xilinx Spartan 2 FPGA could be replaced without changes to the operating system PCI/PCIe device drivers.

      Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits.

      Microchip PolarFire FPGA deliver the industry’s lowest power at mid-range densities with exceptional security and reliability and are ideal for a wide range of applications such as industrial automation. MLE is a Premier Design Partner of the Microchip Ecosystem.

      MLE exhibits at SC22

      Partner ProDesign and MLE will showcase High-Performance Compute solutions at Super Computing Conference SC22. To address the acceleration needs of Disaggregated Computational Storage, ElasticSearch, or At-Speed In-Network Processing the featured solutions integrate MLE’s FPGA-based networking and storage accelerators with ProDesign’s FALCON 1SM21 HPC Card (based on Intel Stratix 10 MX/NX FPGA) and ProDesign’s HAWK VC1902 HPC Card (based on AMD/Xilinx Versal FPGA). Also featured will be Homa, a reliable, rapid request-response protocol (RRRRP) from Stanford University professor John Ousterhout. SC22 is held November 13-18 in the Kay Bailey Hutchinson Convention Center Dallas, TX.

      MLE Joins German 6G Radio Initiative, Receives BMBF Funding

      Integrated Communication and Sensing (ICAS) has become a key research topic for realizing next-generation mobility solutions. For 6G Radio, ICAS enables sensor systems to cooperate and to interact via 6G Radio Sidelink.

      MLE has joined research project “6G-ICAS4Mobility” to closely collaborate with other research partners Robert BOSCH GmbH, AeroDCS GmbH, Barkhausen Institut gGmbH, CiS GmbH, Denso Automotive Deutschland GmbH, Friedrich-Alexander-University Erlangen-Nuremberg, Fraunhofer HHI, Hensoldt Sensors GmbH, IMST GmbH, Merantix Labs GmbH, NXP Semiconductors Germany GmbH, Technical University Ilmenau, Technical University Kaiserslautern and Ulm University for realizing such systems.

      “6G-ICAS4Mobility” has been funded with 14.23 Mio Euros by the German Federal Ministry of Education and Research (BMBF) .

      MLE Presents at SNIA SDC 2022

      At SNIA Storage Developers Conference (SDC) 2022, on Sept. 14, MLE and partner Fraunhofer IPMS will present “Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems”: While the needs for storage in automotive are somewhat relaxed, compared to datacenters, automotive has a need for “unconventional” storage connectivity like many sensors to few CPUs to single SSD. And, unlike datacenters, automotive comes with strong constraints for size, weight and power, and real-time guaranties. Time-Sensitive Networking (TSN) is one of the best positioned options for in-vehicle networking. In combination with reliable transports such as TCP/IP this enables deterministic networking for distributed systems. MLE presents the needs of modern automotive networking and storage architectures, and approaches for converging (real-time) Ethernet and PCIe as a common fabric for reliable and cost-efficient implementations.