Please fill in the form below, so we can support you in your request.
Please fill in the form below, so we can support you in your request.


    ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

    X
    CONTACT MLE
    CONTACT MLE
    We are glad that you preferred to contact us. Please fill our short form and one of our friendly team members will contact you back.


      ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

      X
      CONTACT MLE

      Advantages of Using TCP for GigE Vision Devices

      Allied Vision Technologies GmbH in Stadtroda, Germany, has worked with Missing Link Electronics (MLE) to integrate and to optimize MLE NPAP, the TCP/UDP/IP Full Accelerator Stack from Fraunhofer HHI, into a series next-generation camera products. NPAP, the TCP/IP Full Accelerator from Fraunhofer HHI, provides TCP connectivity in accordance with the GigE Vision standard.

      For more than 30 years, Allied Vision Technologies GmbH has been helping people to reach their imaging goals. Allied Vision supplies camera technology and image capture solutions for industrial inspection, medical and scientific imaging, traffic monitoring, and many more application areas in digital imaging. With a deep understanding of customers’ needs, Allied Vision finds individual solutions for every application, a practice which has made Allied Vision one of the leading camera manufacturers worldwide in the machine vision market. The company has nine locations in Germany, Canada, the United States, Singapore, and China and is represented by a network of sales partners in over 30 countries.

      For more information about the Advantages of Using TCP for GigE Vision Devices please read this White Paper.

      Looking for FPGA-based Solutions for High-Speed GigE Cameras?

      MLE Updates TCP/UDP/IP Network Protocol Accelerator Platform

      MLE has updated NPAP, the Network Protocol Accelerator Platform based on Fraunhofer HHI’s TCP/UDP/IP stack for ASIC and FPGA. Work includes enhancements for performance and interoperability when connecting to Microsoft Windows 10 and Windows 11 TCP stacks. And, in close collaboration with Intel’s Programmable Solutions Group, NPAP was optimized for HyperFlex2 in new Agilex FPGAs. Intel HyperFlex and HyperFlex2 can significantly increase performance via Hyper-Retiming, Hyper-Pipelining and Hyper-Optimizations while avoiding “bloating” the FPGA design.

      MLE Presents at Embedded World 2023

      5G Radio addresses machine-type communication with low energy demands. 5G Edge Clouds reduce processing latency by bringing extra compute close to the “edge”. To be cost efficient, Edge Cloud systems are implemented following modern datacenter technology, such as NVMe. MLE demonstrates an “NVMe-over-5G” implementation, based on MLE’s PCIe Long-Range Tunnel, along with a methodology for detailed latency analysis of 5G URLLC networks. MLE actively contributes to the 6G Platform Germany, an R&D initiative with a total funding of €700 million.

      Jobs

      Opening Positions in MLE

      We are constantly looking for exceptional HW & SW engineers and new team members who enjoy pushing the technology limits of embedded systems by combining the newest programmable FPGA devices from Altera, Lattice and Xilinx with Open Source GNU/Linux and Android. Our projects offer an exciting environment with instant responsibilities and plenty of room to grow.

      If you bring passion to your job, work well in diverse international teams, and thrive in a start-up environment we want to hear from you!

      We have openings in Berlin and Neu-Ulm, Germany, for young talented and senior R&D engineers!

      MLE Opens R&D Offices at Schindler Innovation Hub in Berlin

      Berlin has always been a hot-bed for research and development of new communication technologies. BMBF funded Project 6G-ICAS4Mobility along with the German Platform for Future Communication Technologies and 6G (6G Platform) is one of those many examples. To deepen collaboration between MLE and partners at Technical University Berlin, Berliner Hochschule für Technik, Fraunhofer HHI and Fraunhofer Focus, MLE has opened R&D offices at the Schindler Innovation Campus in Berlin.

      MLE Participates at AMD/Xilinx Security Working Group 2022

      The AMD-Xilinx Security Working Group takes place face-to-face in Munich, Germany, from December 6-7, 2022. Presentations include the latest security features in Versal ACAP and updates for the product roadmap.

      MLE, a Premier AMD-Xilinx Alliance Member, will participate and present its security solutions for ARM OP-TEE and for hardening AMD-Xilinx Zynq UltraScale+ MPSoC based systems when used in datacenter networking and telecommunications.

      MLE Joins Central Car Server Supercomputing Research for Automotive, Funded by German BMBF

      Advanced Driver-Assist Systems (ADAS) and Autonomous Vehicle (AV) functions require a challeging combination of of compute performance and energy efficiency, especially when deployed in Battery Electric Vehicles (BEV).

      MLE has joined research initiative “Central Car Server (CeCaS)” to advance MLE’s PCIe connectivity solutions based on PCIe NTB (Non-Transparent Bridging), PCIe ISB (Inter Systems Bridge), PCIe Long-Range Tunnel along with partners Infineon Technologies Dresden GmbH & Co. KG, Dresden, Robert Bosch GmbH, Continental Automotive Technologies GmbH, ZF Friedrichshafen AG, AVL Software and Functions GmbH, Hella GmbH & Co. KGaA, Infineon Technologies Semiconductor GmbH, Swissbit Germany AG, Kernkonzept GmbH, Ambrosys GmbH, STTech GmbH, Berliner Nanotest und Design GmbH, Glück Engineering GmbH, INCHRON AG, emmtrix Technologies GmbH, Karlsruher Institut für Technologie (KIT), FZI Forschungszentrum Informatik in Karlsruhe, Lübeck University, TU München, Hochschule für angewandte Wissenschaften München, TU Chemnitz, Steinbeis-Transferzentrum Wärmemanagement in der Elektronik (ZFW), Fraunhofer ENAS, Fraunhofer IPMS, Fraunhofer IMWS, Fraunhofer IZM.

      The “CeCaS” research project will investigate heterogeneous architectures and supercomputing for automotive and autonomous vehicles and is funded with 88.2 Mio Euros by the Research Initiative MANNHEIM from German Federal Ministry of Education and Research (BMBF).