Please fill in the form below, so we can support you in your request.
Please fill in the form below, so we can support you in your request.


    ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

    By submitting this form you are consenting to being contacted by the MLE via email and receiving marketing information.

    X
    CONTACT MLE
    CONTACT MLE
    We are glad that you preferred to contact us. Please fill our short form and one of our friendly team members will contact you back.


      ASICAMD (Xilinx)AchronixIntel (Altera)LatticeMicrochip (MicroSemi)Other

      By submitting this form you are consenting to being contacted by the MLE via email and receiving marketing information.

      X
      CONTACT MLE

      FPGA Based 400GBit/s Data Recorder – Insight into Different Pitfalls and Design Choices

      Presentation at the FPGA Conference 2024, Munich, Germany, July 2, 2024
      MLE - FPGA Based 400GBit_s Data Recorder - Insight into different pitfalls and design choices

      Modern Systems can combine a lot of sensors like cameras, radars, Lidar or high speed ADC/DAC. During development, it is often required to record raw data. A FPGA Based High Speed Recorder can collect data from many different sources and can record them on non-volatile memory. Building a High Speed Data Recorder has many pitfalls which can cause the project to fail as a single flaw can have a heavy impact on performance.

      This presentation will walk through our lessons learned from building such a recorder: starting by analyzing the data path, discussing the impact of data granularity and data width, different local buffer options such as DDR / HBM2 / UltraRAM / BRAM, characteristics of AXI4 / PCIe and also the limitations of most NVMe SSDs in the aspect of sustained writing performance. Then the presentation will end with an architectural overview of the final system and the achieved performance.

      Architecture and Performance of Integrated High-speed and Versatile Embedded Networking

      Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 11, 2024

      These days high-performance embedded systems operate highly interconnected. Within these networks the systems often transport data at high bandwidth or low-latency. While the system needs to serve the network performance needs, additional control tasks are to be performed. For the latter task usually a processing system runs a Linux or another real-time embedded operating system. Then the former, high-performance network data cannot be fully handled by the embedded processing system. Thus a high-speed and Versatile Embedded Networking is needed.

      To overcome this situation, a network stack implemented in hardware, e.g. in an FPGA, can offload the processing subsystem. To simplify the system design and reduce cost, the number of physical networking interfaces can be reduced to one. This, on the other hand, requires an architecture that shares a single high-speed network interface across the processing system and the hardware network stack. Usually, embedded systems in addition require highly accurate time synchronization, usually provided via PTPv2.

      The presentation shares the architecture options and results based on an implementation for a high-speed streaming data interface, both a source and a sink that shares a physical network interface with a open source network interface card implementation connected to a processing system. This NIC is operated by a Linux driver and allows for PTPv2 based time synchronization via a Linux daemon. The whole system is implemented into an AMD MPSoC.

      To learn more about the details, download the slides below or contact us for more information.

      TCP/IP for Real-Time Embedded Systems: The Good, the Bad and the Ugly

      Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 9, 2024
      TCP/IP stream scheduling for Real-Time Embedded Systems

      Embedded systems such as in-vehicle networks, modern factory automation or autonomous robots, for example, are undergoing a major shift: Enabled by high-resolution cameras, Radar and Lidar sensors, AI algorithms can implement smartness and ambient awareness, but this need more compute power and higher bandwidth. Industrial and automotive networks must now transport many Gigabits per second, while guaranteeing reliable and secure data delivery, on-time. Thus real-time embedded systems are needed.

      TCP, the Transmission Control Protocol, was introduced half a century ago and is a good protocol used almost everywhere in wired or wireless, robotics, factories, vehicles. Unfortunately, TCP has some bad aspects: A significant computational burden. And some outright ugly: Unpredictable tail latency and head-of-line blocking, making real-time behavior difficult.

      Our presentation shares quantitative analysis results and presents alternatives: For latency analysis we present benchmarks results from network simulation which show the significant tail latencies for TCP and the undesirable outcomes of TCP’s “not-so-fair” scheduling.

      As an alternative we present the Homa protocol from Stanford University. Instead of stream-based connections, Homa is message based and connectionless, which caters better to the needs of modern distributed, microserviced, virtualized embedded architectures. Homa provides significant advantages over TCP when it comes to tail latency and infrastructure efficiency in real-life networks.

      To learn more about the details, download the slides below or contact us for more information.

      Light Rabbit: Implementing a White Rabbit node on COTS AMD development boards without relying on external VCXOs

      Presentation at the 13th White Rabbit Workshop 2024 at CERN in Geneva, Switzerland, Mar. 21-22, 2024
      White Rabbit Network in 6G mobile nodes - Network Synchronization

      White Rabbit is a technology that allows to synchronize networked devices or endpoints tens of kilometers apart with a sub-nanosecond accuracy. With minor, but incompatible changes, it is now fully integrated into the IEEE1588-2019 or PTP v2.1 standard as high accuracy (HA) profile.

      Each endpoint employs frequency and phase measurement and adjustment techniques using field programmable gate arrays (FPGAs) and external voltage-controlled crystal oscillators (VCXOs). This usually requires external circuit boards with specific components not available on commercially off-the-shelf (COTS) development boards.

      We implemented White Rabbit nodes on multiple development boards, e.g. AMD ZC706 and ZCU102, only using the FPGA’s resources such as either Mixed-Mode Clock Managers (MMCMs) on the ZC706 or Quad Phase-Locked-Loops (QPLL) on the ZCU102, capable of fully synchronizing with other White Rabbit hardware, such as a Seven Solutions White Rabbit switch (WRS 3/18).

      We also compared our synchronized endpoints on the ZCU102 and ZC706 to the timing source of the White Rabbit switch. We obtained initial experimental results of our two VCXO-less White Rabbit implementations using a time interval counter (TIC) for measuring the generated pulse-per-second (PPS) signal and a custom Digital Dual Mixer Time Difference (D-DMTD) circuit for the 10 MHz signal. To validate our measurement approach, we also did a spectrum analysis and a time-interval error analysis of the 10 MHz signals with a professional Rohde&Schwarz RTO1044 oscilloscope.

      Spectrum of the 10 MHz signal of White Rabbit node on ZCU102
      Spectrum of the 10 MHz signal generated by the ZCU102 QPLL-based White Rabbit implementation measured by the Rohde&Schwarz RTO 1044 oscilloscope
      Spectrum of the 10 MHz signal of White Rabbit node on ZC706
      Spectrum of the 10 MHz signal generated by the ZC706 MMCM-based White Rabbit implementation measured by the Rohde&Schwarz RTO 1044 oscilloscope

      To learn more about the details, download the slides below or contact us for more informaiton.

      How Bad is TCP? (And What Are the Alternatives?)

      Presentation at SNIA Storage Developers Conference, Fremont, CA, Sept. 18-21, 2023

      Tail latencies in networking tend to worry us all, whether we implement distributed storage and compute or whether we connect systems-of-systems in automotive or factory automation, for example. Same goes for the computational burden of processing networking protocols.

      One of the foundations of reliable networking is TCP, the Transmission Control Protocol which was introduced half a century ago. Today, TCP is ubiquitous: In the data center, in mobile communication, the Internet and in (embedded) systems-of-systems. However, TCP has some significant drawbacks including unpredictable tail latency and a significant computational burden.

      This presentation aims to guide engineers in their systems design by sharing quantitative analysis results and describing alternatives. For latency analysis we present benchmarks results from network simulation which show the significant tail latencies for TCP. We also share benchmark results from running TCP implementations of different Linux kernels – with sometimes surprising outcomes.

      Benchmarks for the computational burden extend our analysis of implementations of TCP processing in various Linux kernels. We discuss a metric for Efficiency as in Throughput per CPU load and compare results.

      Finally, we present Homa from John Ousterhout’s team at Stanford University. Homa is an implementation of a so-called Quad-RP, i.e. Rapid, Reliable Request-Response Protocol: Instead of streams it is message based and connectionless, which caters better to the needs of modern distributed, microserviced, virtualized architectures. It puts the recipients in control which enables proactive approaches to congestion control and thereby achieves better network infrastructure utilization. While not TCP API compatible, overall, Homa provides significant advantages over TCP when it comes to tail latency and infrastructure efficiency in real-life networks.

      We close with an outlook of the potential realizations in ASIC and FPGA to enable energy – efficient, deterministic networking as well as potential use in networked storage.

      Terms-of-Use Policy (June 2023)

      Terms-of-Use Policy (June 2023)

      PLEASE READ THESE TERMS CAREFULLY BEFORE USING OUR WEBSITE

      The materials on this website (the “Site”) are provided by Missing Link Electronics, Inc. (“MLE”) as a service for its customers and may be used for personal and / or informational purposes only. 

      When you access, browse or use this Site you accept, without limitation or qualification, the terms and conditions set forth below and any additional terms and conditions of use set forth in any sub-site. IF YOU DO NOT AGREE TO THEM, DO NOT USE THIS SITE NOR DOWNLOAD ANY MATERIALS FROM IT. Please note that when you enter any sub-site accessible through this homepage or any other page, such sub-site may have its own terms and conditions of use, which is specific to such sub-site. Notwithstanding the foregoing, a legally binding non-disclosure agreement between you and MLE shall supersede this Terms-of-Use Policy to the extent your use of MLE Site is within scope of such non-disclosure agreement.​

      Terms for Use of This Site and Its Contents

      This Site is only for your personal use. You may not reproduce, distribute, republish, mirror, download, display, exchange, modify, sell or transmit any materials you copy from this Site, including but not limited to any software, text, images, audio and video (“Materials”), for any business, commercial or public purpose. All Materials on this Site are copyrighted and are protected by worldwide copyright laws and treaty provisions. Any unauthorized use of the Materials may violate copyright laws, trademark laws, the laws of privacy and publicity, and civil and criminal statutes.

      As long as you comply with the terms of these Terms and Conditions of Use, MLE grants you a non-exclusive, non-transferable, limited right to enter, display and use this Site. This is a license, not a transfer of title, and is subject to the following restrictions:

      You may not: 

      1. modify, alter, tamper with, repair or otherwise create derivative works of the Materials or use them for any commercial purpose, or any public display, performance, sale or rental;
      2. decompile, reverse engineer, or disassemble software Materials except and only to the extent permitted by applicable law;
      3. remove any copyright or other proprietary notices from the Materials;
      4. transfer the Materials to another person; and
      5. use the Site to: (i) store or transmit inappropriate content, such as content that violates the intellectual property rights or rights to the publicity or privacy of others; (ii) store or transmit any content that contains or is used to initiate a denial of service attack, software viruses or other harmful or deleterious computer code, files or programs such as Trojan horses, worms, time bombs, cancelbots, or spyware; or (iii) otherwise violate the legal rights of a third party;
      6. interfere with or disrupt servers or networks used by MLE to provide the Site or used by other users to access the Site, or violate any third party regulations, policies or procedures of such servers or networks or harass or interfere with another user’s full use and enjoyment of the Site;
      7. access or attempt to access MLE’s other accounts, computer systems or networks not covered by these Terms, through password mining or any other means;
      8. cause, in MLE’s sole discretion, inordinate burden on the Site or on MLE’s system resources or capacity; or
      9. share passwords or other access information or devices or otherwise authorize any third party to access or use the licensed products or the Site.

      The Materials may not be copied, reproduced, modified, published, uploaded, posted, transmitted, or distributed in any way, without MLE’s prior written permission. MLE may terminate this license at any time if you are in breach of the terms of these Terms and Conditions of Use. Upon termination, you will immediately destroy the Materials.

      All contents of the Site including but not limited to design, text, software, technical drawings, configurations, graphics, other files, and their selection and arrangement are: Copyright © 2023 Missing Link Electronics, Inc., and/or the proprietary property of its suppliers, affiliates, or licensors. All Rights Reserved.  

      MLE and the MLE logo are, including without limitation, either trademarks or registered trademarks of MLE, and may not be copied, imitated, or used, in whole or in part, without MLE’s prior written permission or that of our suppliers or licensors. MLE is not granting you any license to utilize those proprietary logos, service marks, or trademarks. Except as expressly provided herein, MLE, its partners and its suppliers do not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. 

      Report Abuse

      If you become aware of any material on the Service that contravenes this Terms-of-Use Policy, please notify MLE by email or by using the abuse reporting system on the Service.  You must immediately notify MLE in writing of any unauthorized use of any account, licensed product, or Service that comes to your attention.  In the event of any such unauthorized use by any third party that obtained access through you, you will take all steps necessary to terminate such unauthorized use.  You will provide MLE with such cooperation and assistance related to any such unauthorized use as MLE may reasonably request.

      Privacy

      In order to operate and provide the Site, MLE collects certain information about you. As part of the Site, MLE may also automatically upload information about your computer or device, your use of the Site, and Site performance. MLE uses and protects that information as described in the privacy policy located here: https://www.missinglinkelectronics.com/privacy-policy/ (“Privacy Policy”). You further acknowledge and agree that MLE may access or disclose information about you, including the content of your communications, in order to: (a) comply with the law or respond to lawful requests or legal process; (b) protect the rights or property of MLE or our customers, including the enforcement of our agreements or policies governing your use of the Site; or (c) act on a good faith belief that such access or disclosure is necessary to protect the personal safety of MLE employees, customers, or the public. MLE retains the right to block or otherwise prevent delivery of any type of file, email or other communication to or from the Site as part of our efforts to protect the Site, protect our customers, or stop you from breaching these Terms. The technology or other means we use may hinder or break your use of the Site.

      Materials and Communications Sent to MLE

      Any material, information, message or other communication you transmit or post to this Site will be considered non-confidential and non-proprietary (“Communications”). Thus, you give up any claim that any use of such material violates any of your rights including moral rights, privacy rights, proprietary or other property rights, publicity rights, rights to credit for material or ideas, or any other right, including the right to approve the way MLE uses such material. MLE will have no obligations with respect to the Communications. MLE and its designees will be free to copy, disclose, distribute, incorporate and otherwise use the Communications and all data, images, sounds, text, and other things embodied therein for any and all commercial or non-commercial purposes. 

      You are prohibited from posting or transmitting to or from this Site any unlawful, threatening, libelous, defamatory, obscene, pornographic, or other material that would violate any law or third party’s intellectual property rights. 

      Any material submitted to this Site may be adapted, broadcast, changed, copied, disclosed, licensed, performed, posted, published, sold, transmitted or used by MLE anywhere in the world, in any medium, forever. Furthermore, MLE is free to use, without any compensation to you, any concepts, ideas, know-how or techniques contained in any communication you send to the Site for any purpose whatsoever, including but not limited to developing, manufacturing and marketing products using such information. However, you agree and understand that MLE is not obligated to use any such ideas or materials and you have no rights to compel such use.

      Transmitted Material

      Internet transmissions are never completely private or secure. You understand that any Communication you send to this Site may be read or intercepted by others unless there is a special notice that a particular message (for example, credit card information) is encrypted (sent in code). Sending a message to MLE does not cause MLE to have any special responsibility to you, and you agree that faulty transmission and/or third party interception is a risk.  You assume that risk by submitting information over the internet, and you agree to hold MLE harmless in the event that information is received by an unintended third party.

      Links

      This Site may contain links to other Internet sites on the World Wide Web. MLE provides such links for your convenience only, and is not responsible for the content of any site linked to or from this Site. Links from this Site to any other site do not mean that MLE approves of, endorses or recommends that site. MLE reserves the right to terminate any link or linking program at any time. MLE disclaims all warranties, express or implied, as to the accuracy, legality, reliability or validity of any content on any other site. If you decide to access any of the third party sites linked to this Site, you do this entirely at your own risk.

      Availability of Products and Services

      The products and services displayed on the Site may not be available for purchase in your particular country or locality. The reference to such products and services on the Site does not imply or warrant that these products or services will be available at any time in your particular location. 

      Online Pricing, Specifications and Availability

      Prices, specifications and availability of products sold on www.missinglinkelectronics.com are subject to change without notice. MLE is not liable for any typographical, photographic or specification error in product, pricing or offers which are all subject to correction.

      Disclaimer

      THE MATERIALS ON THIS SITE ARE PROVIDED “AS IS” WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL MLE OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGES WHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, LOSS OF INFORMATION, INDIRECT, CONSEQUENTIAL OR PUNITIVE DAMAGES) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF MLE HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. MLE and its suppliers further do not warrant the accuracy or completeness of the information, text, graphics, links or other items contained within these materials. MLE may make changes to these materials, or to the products described therein, at any time without notice. MLE makes no commitment to update the Materials.

      Indemnification

      You agree to indemnify, defend and hold MLE and all of its agents, directors, officers, employees, information providers, licensors and licensees and affiliates, (collectively, “Indemnified Parties”) harmless from and against any and all liability and costs (including, without limitation, attorneys’ fees and costs), incurred by the Indemnified Parties in connection with any claim arising out of any breach by you of these Terms and Conditions of Use. You will cooperate as fully as reasonably required in MLE’s defense of any claim. MLE reserves the right, at its own expense, to assume the exclusive defense and control of any matter otherwise subject to indemnification by you and you shall not in any event settle any matter without the written consent of MLE.

      Right to Change These Terms-of-Use or Content on the Site

      MLE may add to, change or remove any part of these Terms and Conditions of Use at any time, without notice. Any changes to these Terms and Conditions of Use or any terms posted on this Site apply as soon as they are posted. By continuing to use this Site after any changes are posted, you are indicating your acceptance of those changes. MLE may add, change, discontinue, remove or suspend any other Materials posted on this Site, including features and specifications of products described or depicted on the Site, temporarily or permanently, at any time, without notice and without liability.

      Suspension and Termination of Your Use

      MLE reserves the right to temporarily suspend or terminate your access to the Site at any time in our sole discretion, with or without cause, and with or without notice, without incurring liability of any kind.  For example, we may suspend or terminate your access to or use of the Service for: (a) the actual or suspected violation of the Agreement or this Terms-of-Use Policy; (b) the use of the  in a manner that may cause MLE to have legal liability or disrupt others’ use of the Site; (c) the suspicion or detection of any malicious code, virus or other harmful code by you or in your account; (d) scheduled downtime and recurring downtime; (e) use of excessive storage capacity or bandwidth; or (f) unplanned technical problems and outages.  If, in MLE’s determination, the suspension might be indefinite and/or MLE has elected to terminate your access to the Service, MLE will use commercially reasonable efforts to notify you through the Site.  You acknowledge that if your access to the Site is suspended or terminated, you may no longer have access to the Code that is stored with the Site.

      General Terms

      This site is controlled by MLE from its offices within the United States of America. MLE makes no representation that Materials in the site are appropriate or available for use in other locations, and access to them from territories where their content is illegal is prohibited. Those who choose to access this site from other locations do so on their own initiative and are responsible for compliance with applicable local laws. You may not use or export the Materials in violation of U.S. export laws and regulations. Any claim relating to the Materials shall be governed by the internal substantive laws of the State of California, United States of America. Any cause of action you may have with respect to your use of this Site must be commenced within (1) year after the claim or cause of action arises. If for any reason a court of competent jurisdiction finds any provision of these Terms and Conditions of Use, or portion thereof, to be unenforceable, that provision shall be enforced to the maximum extent permissible so as to effect the intent of this agreement, and the remainder of these Terms and Conditions of Use shall continue in full force and effect.

      Technical Publications

      Technical Publications

      MLE has been invited to numerous international seminars and webinars to share our experience in FPGA development using advanced PCI Express, TCP/UDP/IP stacks, and low-latency IP-core technologies for network and storage acceleration. Here we share the full technical articles and slides of the up-to-date presentations.

      MLE - FPGA Based 400GBit_s Data Recorder - Insight into different pitfalls and design choices

      FPGA Based 400GBit/s Data Recorder – Insight into Different Pitfalls and Design Choices

      Jul 8, 20243 weeks ago

      Presentation at the FPGA Conference 2024, Munich, Germany, July 2, 2024 Modern Systems can combine a lot of sensors like cameras, radars, Lidar or high speed ADC/DAC. During development, it…

      Architecture and Performance of Integrated High-speed and Versatile Embedded Networking

      Architecture and Performance of Integrated High-speed and Versatile Embedded Networking

      Apr 17, 20243 months ago

      Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 11, 2024 These days high-performance embedded systems operate highly interconnected. Within these networks the systems often transport data at high bandwidth…

      TCP/IP for Real-Time Embedded Systems: The Good, the Bad and the Ugly

      TCP/IP for Real-Time Embedded Systems: The Good, the Bad and the Ugly

      Apr 17, 20243 months ago

      Presentation at the Embedded World 2024, Nuremberg, Germany, Apr. 9, 2024 Embedded systems such as in-vehicle networks, modern factory automation or autonomous robots, for example, are undergoing a major shift:…

      Light Rabbit: Implementing a White Rabbit node on COTS AMD development boards without relying on external VCXOs

      Light Rabbit: Implementing a White Rabbit node on COTS AMD development boards without relying on external VCXOs

      Mar 26, 20244 months ago

      Presentation at the 13th White Rabbit Workshop 2024 at CERN in Geneva, Switzerland, Mar. 21-22, 2024 White Rabbit is a technology that allows to synchronize networked devices or endpoints tens…

      How Bad is TCP? (And What Are the Alternatives?)

      How Bad is TCP? (And What Are the Alternatives?)

      Sep 20, 202310 months ago

      Presentation at SNIA Storage Developers Conference, Fremont, CA, Sept. 18-21, 2023 Tail latencies in networking tend to worry us all, whether we implement distributed storage and compute or whether we…

      Composable Edge Cloud Systems With NVMe-over-5G URLLC

      Composable Edge Cloud Systems With NVMe-over-5G URLLC

      Mar 14, 20231 year ago

      Presentation at Embedded World 2023, Nuremberg, Germany 5G Radio addresses machine-type communication with low energy demands. 5G Edge Clouds reduce processing latency by bringing extra compute close to the “edge”.…

      Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems

      Converging PCIe and TSN Ethernet for Composable Infrastructure in High-Performance In-Vehicle Embedded Systems

      Aug 22, 20222 years ago

      Presentation at SNIA Storage Developers Conference, San Jose, Sept. 12-15, 2022 Costs and risks of implementing High-Performance Embedded Systems such as Centralized Car Servers for Autonomous Vehicles can be reduced…

      10 GigE TCP/IP Stack for High-Speed Camera Transport

      10 GigE TCP/IP Stack for High-Speed Camera Transport

      Jul 7, 20222 years ago

      Presentation at FPGA Conference Europe in Munich, Germany, July 5-7, 2022 MLE presents NPAP, a TCP/IP full accelerator from Fraunhofer HHI, for use in Multi-Gigabit High-Speed Camera Image Transport. With…

      Zone-Based Automotive-Backbones

      Zone-Based Automotive-Backbones

      Jun 1, 20222 years ago

      Presentation at Automotive Ethernet Congress in Munich, Germany, June 1-2, 2022 Fraunhofer IPMS and MLE present a joint work on how to combine TSN Ethernet and TCP/IP as an ultra-reliable…

      Platform Choices for FPGA-Based In-Network Compute Acceleration

      Platform Choices for FPGA-Based In-Network Compute Acceleration

      Apr 28, 20222 years ago

      Presentation at SmartNICsSummit 2022, April 26-28, 2022 FPGA-based SmartNICs can provide significant benefits by offloading network data processing off of CPU cores, data-in-motion processing, effectively enabling In-Network Compute. However, FPGA…

      Resources

      Resources

      Here you can find helpful information, links and material on:

      Online Demo      |      Technical Publications      |      Application Notes      |      Discontinued Product Support

      Technical Publications

      MLE has been invited to numerous international seminars and webinars to share our experience in FPGA development using advanced PCI Express, TCP/UDP/IP Network Protocol Accelerator Platforms (NPAP), and low-latency IP-core technologies. Full technical articles and slides of the presentations are available here.

      Linux Cross Reference

      LXR (formerly “the Linux Cross Referencer”) is a software toolset for indexing and presenting source code repositories. LXR was initially targeted at the Linux source code, but has proved usable for a wide range of software projects. MLE provides this service to everybody interested on MLE’s LXR.

      Developer Zone

      MLE is professional in building the prototyping system for short Time-to-Market projects, analyzing and improving latency in a network protocol processing system, and accelerating algorithms and communication protocols based on FPGA. MLE’s research for applications in Deterministic Networking, Streaming Data Storage, and I/O Connectivity is shared in MLE Developer Zone.

      User Guide

      Xilinx Wiki page Almost all user documentation for MLE’s products and solutions are available online.

      Products co-developed with Xilinx, such as the Zynq SATA Storage Extension, can be found on the Xilinx Wiki page.

      Documentation for the MLE internally developed products can be found in MLE’s Developer Zone.

      Virtual Patent Marking

      Virtual Patent Marking

      Missing Link Electronics, Inc. (MLE) is a provider of Semiconductor Intellectual Property Cores (IP Cores) and electronic subsystems. MLE’s technology is used in products and licensable solutions and system stacks sold, which are offered by MLE and by commercial partners.

      This page is intended to serve as notice under 35 U.S.C. § 287(a).

      The following patents apply to MLE products:

      MLE ProductPatents
      Auto/TSNUS Patent No. 9,209,828
      US Patent No. 10,708,199
      US Patent No. 10,848,442
      US Patent No. 11,356,388
      US Patent No. 11,695,708
      Other Patents Pending
      PCIe Long-Range TunnelUS Patent No. 10,708,199
      US Patent No. 10,848,442
      US Patent No. 11,356,388
      US Patent No. 11,695,708
      Other Patents Pending
      NVMe/TCP IP CoreUS Patent No. 10,708,199
      US Patent No. 10,848,442
      US Patent No. 11,356,388
      US Patent No. 11,695,708
      Other Patents Pending
      PCIe Non-Transparent Bridge (NTB)US Patent No. 10,708,199
      US Patent No. 10,848,442
      US Patent No. 11,356,388
      US Patent No. 11,695,708
      Other Patents Pending
      Soft ADCUS Patent No. 10,140,049
      US Patent No. 10,509,880
      Other Patents Pending
      Soft DACUS Patent No. 10,140,049
      US Patent No. 10,509,880
      Other Patents Pending